Y. Jo+, S. H. Bae+, B. J. Baek, D. Y. Kim, S. J. Hong, H. C. Jo, Y. J. Cho, M. K. Cho, J. H. Park*, S. Jeong*
Hierarchically Assembled Plasmonic Ni/Cu Particles enabling Highly Conductive Nickel Current Collectors for High-Voltage All-Printed Microsupercapacitors
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Journal
Chemical Engineering Journal
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Volume
536
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Page
175915
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Year
2026
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Impact Factor
13.2, Top 3.0% [JCR 2024]
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File
Hierarchically assembled plasmonic NiCu particles.pdf
(4.7M)
Hierarchically Assembled Plasmonic Ni/Cu Particles enabling Highly Conductive Nickel Current Collectors for High-Voltage All-Printed Microsupercapacitors


